2019 International Electronic Circuit (Shenzhen) Exhibition
Jul 28,2022
(Hong Kong, October 23, 2019) The 2019 International Electronic Circuit (Shenzhen) Exhibition will be held from December 4th to 6th, 2019, formerly known as the International Printed Circuit Board and Electronic Assembly South China Exhibition. This year, in addition to covering Halls 1, 2, and 4 of the Shenzhen Convention and Exhibition Center, a new exhibition hall - Hall 9 and some booths in Hall 3 - has been added. This year's exhibition area exceeds 67,500 square meters, with nearly 3,500 booths, setting a new record and becoming the largest exhibition ever held.
The newly added Hall 9 will bring together more PCB equipment suppliers, showcasing more and richer innovative equipment and technologies to visitors. More than 100 exhibitors, including MOKO, Taiwan Gangjian, Lukang, Maichuangli, Haoshuo, Lingchuang, J Autotec, Guangyunda, Ouxi, Tiancheng, Taiwan Longze, Huaheng, Engel, Keqiao, Jali Fu, Gangshida, Shengxiong, and Mengxing, will make their grand appearance in Hall 9.
Meeting market demands with rich exhibition content, comprehensively covering the entire industry chain
It is predicted that the global 5G market will develop rapidly from 2018 to 2025. This will strengthen the interconnected applications of a series of intelligent technologies such as the Internet of Things (IoT), artificial intelligence, big data, cloud computing, and autonomous vehicles, creating many business opportunities for the PCB industry. As one of the most influential and representative PCB and electronic assembly industry exhibitions globally, the exhibition covers all aspects of the entire industry chain and is the best business platform for industry professionals to explore the latest technologies and develop their businesses.
Among the nearly 600 exhibitors this year, 112 are first-time exhibitors from various countries and regions including mainland China, Hong Kong, Taiwan, South Korea, Japan, France, Sweden, and Germany. These include well-known domestic and international brands and emerging companies such as Lauffer, Leica, Qihai, Disheng, Maslan, Tengtong, Chaoyue, Zhiwei, Dishi Kunguang, Jexun, Traco World, Xingshan, Enpas, V Technology, Asahi Denka, Balin, and Forlex.
International Technical Conference Invites Authoritative Experts to Share Industry Hot Topics
As one of the highlights of the exhibition, the three-day International Technical Conference will invite industry experts to share their insights on the latest industry development trends and innovative technologies with attendees. This year, Mr. Liu Zhe, Chief Engineer of Technology Research at ZTE Corporation, has been specially invited to give a special speech, sharing the challenges and needs brought by 5G high frequency to PCBs. Other heavyweight speakers include Dr. Hayao Nakahara, President of N.T. Information; Dr. Jiang Xugao, Partner of Prismark; and Mr. Lin Dinghao, Senior Project Manager of the Technology Research and Development Center of Jingshuo Technology Co., Ltd.
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