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The scale of 2019 International Electronic Circuit (Shenzhen) Exhibition has reached a new high!

The scale of 2019 International Electronic Circuit (Shenzhen) Exhibition has reached a new high!

The scale of 2019 International Electronic Circuit (Shenzhen) Exhibition has reached a new high!

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  • Time of issue:2020-06-15 16:19
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(Summary description)(Hong Kong, October 23, 2019) The 2019 International Electronic Circuits (Shenzhen) Exhibition will be held from December 4 to 6, 2019, formerly known as the International Circuit Board and Electronic Assembly South China Exhibition. This year's exhibition, in addition to covering halls 1, 2, and 4 of the Shenzhen Convention and Exhibition Center, also added a brand-new hall-9 and some booths in hall 3. With an exhibition area of ​​more than 67,500 square meters and close to 3,500 booths, the scale of this exhibition has reached a new high, becoming the largest exhibition ever.

The scale of 2019 International Electronic Circuit (Shenzhen) Exhibition has reached a new high!

(Summary description)(Hong Kong, October 23, 2019) The 2019 International Electronic Circuits (Shenzhen) Exhibition will be held from December 4 to 6, 2019, formerly known as the International Circuit Board and Electronic Assembly South China Exhibition. This year's exhibition, in addition to covering halls 1, 2, and 4 of the Shenzhen Convention and Exhibition Center, also added a brand-new hall-9 and some booths in hall 3. With an exhibition area of ​​more than 67,500 square meters and close to 3,500 booths, the scale of this exhibition has reached a new high, becoming the largest exhibition ever.

  • Categories:News
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  • Time of issue:2020-06-15 16:19
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(Hong Kong, October 23, 2019) The 2019 International Electronic Circuits (Shenzhen) Exhibition will be held from December 4 to 6, 2019, formerly known as the International Circuit Board and Electronic Assembly South China Exhibition. This year's exhibition, in addition to covering halls 1, 2, and 4 of the Shenzhen Convention and Exhibition Center, also added a brand-new hall-9 and some booths in hall 3. With an exhibition area of ​​more than 67,500 square meters and close to 3,500 booths, the scale of this exhibition has reached a new high, becoming the largest exhibition ever.
 
The newly-added Hall 9 will gather more circuit board equipment suppliers to show visitors more and more innovative equipment and technologies. Including Mude, Taiwan Port Construction, Lukang, Microtronics, Haoshuo, Leading, J Auto, Guangyunda, Oerxi, Tiancheng, Taiwan Takizawa, Huaheng, Enge, Keyao, Jiali More than 100 exhibitors including Fortune, Gangstar, Shengxiong, and Mengxing will make their grand appearance in Hall 9.
 
Catering to the rich display content of the market, fully covering the entire industry chain
 
It is predicted that from 2018 to 2025, the global 5G market will develop rapidly, which will strengthen the connected applications of a series of smart technologies such as the Internet of Things (IoT), artificial intelligence, big data, cloud computing, and autonomous vehicles. Create many business opportunities. As one of the most influential and representative circuit board and electronic assembly industry exhibitions in the world, the scope of exhibits at the exhibition covers all links of the entire industry chain of the industry, and is the best business for industry professionals to explore the latest technology and develop business platform.
 
Among the nearly 600 exhibitors this year, 112 of them are new exhibitors for the first time. They are from China, Hong Kong, Taiwan, South Korea, Japan, France, Sweden, Germany and other countries and regions, including Lauffer , Leica, Seven Seas, Disheng, Maslan, Tentong, Transcendence, Zhiwei, Topography Kunguang, Jircom, Traco World, Xingshan, Enpas, V Technology, Asahi Dencai, Baling, Flex, etc. Well-known brands and emerging companies.
 
International technical conference invited authoritative experts to share industry hot topics
 
As one of the highlights of the exhibition-the 3-day international technical conference will invite industry experts to share their insights on the latest industry development trends and innovative technologies with the participants. This year, Mr. Liu Zhe, chief engineer of ZTE's process technology research, was specially invited to give a special speech to share the challenges and needs of 5G high-frequency PCBs for participants. In addition, other heavyweight speakers include Dr. Hayao Nakahara, president of N.T. Information, Dr. Jiang Xugao, partner of Prismark, and Mr. Lin Dinghao, senior project director of the Technology R&D Center of Kinsus Technology Co., Ltd.

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